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Flip Chip CSP Substrate: Efficiency, Reliability, and Application - Shenzhen

(Shenzhen)

Post #: A45711004
Posted on: 01 February
Reply to: (Use contact form below)
Price(CNY): (Not Provided)
Ad Type: For Sale
Price Format: ---
 

A flip chip basically implies that the chip is flipped over to make an association with the substrate or lead outline. Flip chip doesn't rely upon the wire holding for of interconnection however it utilizes bind or knocks like copper support point. This implies that the I/O cushions can be put at any part of the outer layer of the chip and thusly the chip size can be diminished with a suitable hardware way.

Contact us :-https://efpcb.wordpress.com/2024/09/25/flip-chip-csp-substrate-efficiency-reliability-and-application/
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Flip Chip CSP Substrate: Efficiency, Reliability, and Application - Shenzhen Computer Accessories




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