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At its core, flip chip IC substrate Technology involves the direct electrical connection of semiconductor dies to substrates or other dies, utilizing solder bumps as the medium of connection. Unlike conventional wire bonding, where wires are used to connect the die to the package, Flip Chip Technology flips the die upside down and connects it directly to the substrate. This arrangement allows for shorter interconnects, reduced parasitic capacitance, and improved thermal dissipation, thereby enhancing performance and reliability.
Contact info:- https://efpcb.wordpress.com/2024/04/24/know-about-the-basic-details-of-flip-chip-technology/
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Ad Detail: Know About the Basic Details of Flip Chip Technology
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